Multi-layer printed circuit board fabrication system and method

Data processing: generic control systems or specific application – Specific application – apparatus or process – Product assembly or manufacturing

Reexamination Certificate

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Details

C382S145000, C382S294000, C348S087000, C438S007000

Reexamination Certificate

active

07062354

ABSTRACT:
A method for aligning an image to be recorded by a direct image scanner on an upper layer of a printed circuit board with an image recorded on a lower layer thereof, the method comprising visually imaging a portion of the image on the lower layer and recording a pattern on the upper layer, referenced to coordinates of the visual image of the portion.

REFERENCES:
patent: 5170058 (1992-12-01), Berasi et al.
patent: 5386221 (1995-01-01), Allen et al.
patent: 5388515 (1995-02-01), Schneider et al.
patent: 5388517 (1995-02-01), Levien
patent: 5548372 (1996-08-01), Schroeder et al.
patent: 5643699 (1997-07-01), Walder
patent: 6037967 (2000-03-01), Allen et al.
patent: 6165658 (2000-12-01), Taff et al.
patent: 6205364 (2001-03-01), Lichtenstein et al.
patent: 6567713 (2003-05-01), Lichtenstein et al.
patent: WO 94/09989 (1994-05-01), None
patent: WO 00/02424 (2000-01-01), None
patent: WO 02/3979 (2002-05-01), None
T. Sandstrom et al., “Highly accurate pattern generation using acousto-optical deflection”, SPIE vol. 1463, Optical/Laser Microlithography, , pp. 629-637, 1991.
D. Maydan, “Micromachining and image recording on thin films by laser beams”, Bell System Technical Journal, vol. 50, No. 6, Jul-Aug., 1971, USA.
H. Ulrich et al., “Direct Writing Laser Lithography for Production of Microstructures”, Microelectronic Engineering 6, (1987), pp. 77-84.

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