Multi-layer printed circuit board comprising a through...

Details Multi-layer printed circuit board comprising a through... Multi-layer printed circuit board comprising a through...

2008-07-01

2008-07-01

Norris, Jeremy C (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C361S794000, C029S830000

Reexamination Certificate

active

11180756

ABSTRACT:
A high frequency multi-layer printed circuit board, according to the present invention, comprises a through connection having an impedance adapting structure surrounding the through connection and enabling an adjustment of the characteristic impedance of the through connection to a desired value. Thus, high frequency signals may be led through the printed circuit board with reduced signal deformation. The high frequency multi-layer printed circuit board is applicable for high frequency signals up to the GHz-range.

REFERENCES:
patent: 5689091 (1997-11-01), Hamzehdoost et al.
patent: 5829127 (1998-11-01), Hagner
patent: 6229095 (2001-05-01), Kobayashi
patent: 2002/0034839 (2002-03-01), Iwaki et al.
patent: 2002/0180004 (2002-12-01), Oggioni et al.
patent: 2004/0069529 (2004-04-01), Oggioni et al.
patent: 2005/0230813 (2005-10-01), Nakamura et al.
patent: 2005/0247482 (2005-11-01), Nakamura
patent: 103 05 855 (2004-08-01), None
patent: WO 98/27793 (1998-06-01), None
patent: WO 2004/107830 (2004-09-01), None
patent: WO 2005/084089 (2005-09-01), None
Jillek and Keller, “Handbuch der Leiterplattentechnik,” vol. 4, p. 524, 2003.
International Search Report dated Jun. 29, 2006.

Affiliated with

Also associated with

Rating

Multi-layer printed circuit board comprising a through... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multi-layer printed circuit board comprising a through..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multi-layer printed circuit board comprising a through... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3927055