Multi-layer printed circuit board comprising a through...

Details Multi-layer printed circuit board comprising a through... Multi-layer printed circuit board comprising a through...

2008-07-01

2008-07-01

Norris, Jeremy C (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C361S794000, C029S830000

Reexamination Certificate

active

07394027

ABSTRACT:
A high frequency multi-layer printed circuit board, according to the present invention, comprises a through connection having an impedance adapting structure surrounding the through connection and enabling an adjustment of the characteristic impedance of the through connection to a desired value. Thus, high frequency signals may be led through the printed circuit board with reduced signal deformation. The high frequency multi-layer printed circuit board is applicable for high frequency signals up to the GHz-range.

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