Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Patent
1993-02-10
1994-11-29
Picard, Leo P.
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
174 34, 174251, 174254, 174267, 361749, 361785, 439 79, H05K 100
Patent
active
053692195
ABSTRACT:
A multi-layer printed circuit board is disclosed as having more layers and greater accuracy in the conductive traces of those layers than has been previously possible. Using the disclosed multi-layer printed circuit boards can be built having a conductive path width of 0.5 mils (0.0127 mm) and spacing between such conductive traces of 0.5 mils (0.0127 mm). The method enables multi-layer boards to be created having more than eight layers, and still maintaining the desired 0.5 mil conductive path width and spacing. The enhanced accuracy and increased number of layers is made possible by use of adjustments to customer-supplied art work based upon evaluation of test pieces made early in the procedure. By use of the disclosed method, multi-layer printed circuit boards can he built having a high density of coaxial cable equivalents and tuned wave guide equivalents. An apparatus is also disclosed which connects the coaxial cable equivalents and tuned wave guide equivalents from one multi-layer printed circuit board to a second multi-layer printed circuit board.
REFERENCES:
patent: 3601762 (1971-08-01), Eshelman
patent: 4306925 (1981-12-01), Lebow et al.
patent: 4325780 (1982-04-01), Schulz
patent: 4600663 (1986-07-01), Robertson
patent: 4606788 (1986-08-01), Moran
patent: 4631100 (1986-12-01), Pellegrino
patent: 4642421 (1987-02-01), Dery et al.
patent: 4646436 (1987-03-01), Crowell
patent: 4663208 (1987-05-01), Ninomiya et al.
patent: 4707394 (1987-11-01), Chant
patent: 4722765 (1988-02-01), Ambros et al.
patent: 4756795 (1988-07-01), Bakos et al.
patent: 4781969 (1988-11-01), Kobayashi et al.
patent: 4845311 (1989-07-01), Schreiber et al.
patent: 5185654 (1993-02-01), Mosher et al.
Lipmann et al., A Specific Micromethod for the Determination of Acyl Phosphates, J. Biol. Chem. 159:21 (1954).
23rd General Meeting of the Association of Japanese Journal of Clinical Laboratory Automation, vol. 16:222-223 (1991).
Folk et al., Molecular and Catalytic Properties of Transglutaminases, Adv. Enzymol., 38:109-191 (1973).
Figlin Cheryl R.
Multimedia Design, Inc.
Picard Leo P.
LandOfFree
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