Multi-layer printed circuit board and process for production the

Details Multi-layer printed circuit board and process for production the Multi-layer printed circuit board and process for production the

1983-10-12

1985-07-02

Herbert, Thomas J.

Stock material or miscellaneous articles

Composite

Of epoxy ether

156248, 1563071, 4284735, 428901, 525403, B32B 2738, B32B 2728, C09J 502

Patent

active

045268355

ABSTRACT:
A multi-layer printed circuit board produced by laminating a plurality of unit circuit sheets via prepreg resin sheets, the cured resin in said unit circuit sheet having a glass transition temperature Tg.sub.1, said prepreg resin sheets having been prepared by impregnating a reinforcing substrate with a resin composition which can be cured at a temperature equal to or lower than both the glass transition temperature of Tg.sub.1 and that of Tg.sub.2 of the resin in the prepreg resin sheet after cured, and binding the laminated sheets with heating under pressure at a temperature equal to or lower than both the temperatures of Tg.sub.1 and Tg.sub.2, has excellent dimensional stability, heat resistance and through-hole reliability.

REFERENCES:
patent: 4338149 (1982-07-01), Quaschner
patent: 4482703 (1984-11-01), Takahashi et al.

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