Multi-layer printed circuit board and method of...

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

Reexamination Certificate

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C174S255000, C174S262000

Reexamination Certificate

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07985930

ABSTRACT:
A metal layer18is sandwiched between insulating layers14and20so that required strength is maintained. Hence it follows that the thickness of a core substrate30can be reduced and, therefore, the thickness of a multi-layer printed circuit board can be reduced. Formation of non-penetrating openings22which reach the metal layer18in the insulating layers14and20is simply required. Therefore, small non-penetrating openings22can easily be formed by applying laser beams. Thus, through holes36each having a small diameter can be formed.

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