Multi-layer printed circuit board and method of...

Details Multi-layer printed circuit board and method of... Multi-layer printed circuit board and method of...

2011-07-26

2011-07-26

Patel, Ishwarbhai B. (Department: 2835)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S255000, C174S262000

Reexamination Certificate

active

07985930

ABSTRACT:
A metal layer18is sandwiched between insulating layers14and20so that required strength is maintained. Hence it follows that the thickness of a core substrate30can be reduced and, therefore, the thickness of a multi-layer printed circuit board can be reduced. Formation of non-penetrating openings22which reach the metal layer18in the insulating layers14and20is simply required. Therefore, small non-penetrating openings22can easily be formed by applying laser beams. Thus, through holes36each having a small diameter can be formed.

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