Multi-layer printed circuit board and method for fabricating...

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

Reexamination Certificate

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Details

C174S261000, C174S262000, C361S778000

Reexamination Certificate

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07834274

ABSTRACT:
A method for fabricating a double-sided or multi-layer printed circuit board (PCB) by ink-jet printing that includes providing a substrate, forming a first self-assembly membrane (SAM) on at least one side of the substrate, forming a non-adhesive membrane on the first SAM, forming at least one microhole in the substrate, forming a second SAM on a surface of the microhole, providing catalyst particles on the at least one side of the substrate and on the surface of the microhole, and forming a catalyst circuit pattern on the substrate.

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Office Action issued in corresponding Taiwanese Application.

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