Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate
2006-10-31
2010-11-16
Dinh, Tuan T (Department: 2841)
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
C174S261000, C174S262000, C361S778000
Reexamination Certificate
active
07834274
ABSTRACT:
A method for fabricating a double-sided or multi-layer printed circuit board (PCB) by ink-jet printing that includes providing a substrate, forming a first self-assembly membrane (SAM) on at least one side of the substrate, forming a non-adhesive membrane on the first SAM, forming at least one microhole in the substrate, forming a second SAM on a surface of the microhole, providing catalyst particles on the at least one side of the substrate and on the surface of the microhole, and forming a catalyst circuit pattern on the substrate.
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Office Action issued in corresponding Taiwanese Application.
Cheng Chao-Kai
Lee Chang-Ming
Tseng Tzyy-Jang
Wang Chung-Wei
Wu Chia-Chi
Alston & Bird LLP
Aychillhum Andargie M
Dinh Tuan T
Industrial Technology Research Institute
Unimicron Technology Corp.
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