Multi-layer printed circuit board and method for determining the

Details Multi-layer printed circuit board and method for determining the Multi-layer printed circuit board and method for determining the

1981-10-26

1984-02-14

Kucia, R. R.

Electricity: electrical systems and devices

Miscellaneous

29593, 174 685, 361403, 361414, H05K 346

Patent

active

044320370

ABSTRACT:
A method and apparatus for locating terminal points on an internal conductive layer on an internal board section of a multi-layer printed circuit board assembly. Conductive locating patterns are arranged on the internal board section which are preferably fabricated by the same fabrication technique as for the conductive layer. An electrical probe such as a metal drill is then employed to locate the conductive pattern relative to a reference point. Such information is then used for drilling holes through the internal terminal points.

REFERENCES:
patent: 3859711 (1975-01-01), McKiddy
patent: 3917983 (1975-11-01), Kurinen
patent: 4048438 (1977-09-01), Zimmerman
patent: 4049903 (1977-09-01), Kobler
patent: 4164003 (1979-08-01), Cutchaw
patent: 4208783 (1980-06-01), Luther et al.
T. E. Wray, Broken (Missing) Drill Detection, IBM Tech Disc. Bull., vol. 25, #1, Jun. 1982, pp. 291 & 292.
R. H. Franklin, Drilling of Multilayer Substrates with Laminated Foil Interfaces, IBM Tech. Disc. Bull., vol. 23, #8, p. 3800.

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