Multi-layer printed circuit board, and method for...

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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C029S843000, C029S845000

Reexamination Certificate

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10891190

ABSTRACT:
To provide an interlayer-connected, multi-layer flexible printed circuit board having high bonding reliability and most suitable for micropatterning the circuit layers in the device; and to provide a high-productivity method for fabricating the device.A multi-layer flexible printed circuit board, wherein a conductor is filled in the through-holes formed in the insulating layer in the direction of the thickness thereof so as to electrically interconnect the circuit layers formed on both faces of the insulating layer, and wherein the conductor contains inside it, a copper-core solder ball having a copper ball as a core thereof.

REFERENCES:
patent: 4644643 (1987-02-01), Sudo
patent: 5401911 (1995-03-01), Anderson et al.
patent: 5600099 (1997-02-01), Crotzer et al.
patent: 5971253 (1999-10-01), Gilleo et al.
patent: 6015607 (2000-01-01), Fraivillig
patent: 6087597 (2000-07-01), Shimada et al.
patent: 6320140 (2001-11-01), Enomoto
patent: 6818839 (2004-11-01), Hosaka et al.
patent: 6831236 (2004-12-01), Higuchi et al.
patent: 2001/0004944 (2001-06-01), Nakamura et al.
patent: 2004/0094837 (2004-05-01), Greer
patent: 5175636 (1993-07-01), None
patent: 7176847 (1995-07-01), None

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