Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate
2007-12-04
2007-12-04
Norris, Jeremy C (Department: 2841)
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
C361S761000, C361S762000
Reexamination Certificate
active
10814803
ABSTRACT:
A multi-layer printed circuit board includes: a resin substrate including a plurality of laminated thermoplastic resin films; a thin film resistor embedded in the resin substrate; and an electrode disposed on the thin film resistor. The thermoplastic resin film includes a conductive pattern made of metallic film. The electrode is covered with the conductive pattern disposed over or under the electrode.
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Office Action from Japan Patent Office issued on May 16, 2007 for the corresponding Japanese patent application No. 2003-101461 (a copy and English translation thereof).
Kondo Koji
Tada Kazuo
Takeuchi Satoshi
DENSO CORPORATION
Norris Jeremy C
Posz Law Group , PLC
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