Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2008-05-06
2008-05-06
Norris, Jeremy C (Department: 2841)
Metal working
Method of mechanical manufacture
Electrical device making
C029S843000, C029S845000
Reexamination Certificate
active
07367116
ABSTRACT:
To provide an interlayer-connected, multi-layer flexible printed circuit board having high bonding reliability and most suitable for micropatterning the circuit layers in the device; and to provide a high-productivity method for fabricating the device.A multi-layer flexible printed circuit board, wherein a conductor is filled in the through-holes formed in the insulating layer in the direction of the thickness thereof so as to electrically interconnect the circuit layers formed on both faces of the insulating layer, and wherein the conductor contains inside it, a copper-core solder ball having a copper ball as a core thereof.
REFERENCES:
patent: 4644643 (1987-02-01), Sudo
patent: 5401911 (1995-03-01), Anderson et al.
patent: 5600099 (1997-02-01), Crotzer et al.
patent: 5971253 (1999-10-01), Gilleo et al.
patent: 6015607 (2000-01-01), Fraivillig
patent: 6087597 (2000-07-01), Shimada et al.
patent: 6320140 (2001-11-01), Enomoto
patent: 6818839 (2004-11-01), Hosaka et al.
patent: 6831236 (2004-12-01), Higuchi et al.
patent: 2001/0004944 (2001-06-01), Nakamura et al.
patent: 2004/0094837 (2004-05-01), Greer
patent: 5175636 (1993-07-01), None
patent: 7176847 (1995-07-01), None
Nakashima Kouji
Yoshino Toyokazu
Dickinson Wright PLLC
Matsushita Electric - Industrial Co., Ltd.
Norris Jeremy C
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