Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2007-03-13
2007-03-13
Nguyen, Nam (Department: 1753)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C156S150000, C205S125000, C427S096100, C174S255000
Reexamination Certificate
active
10981778
ABSTRACT:
A fabricating method for a multi-layer printed circuit board is provided. The method may include attaching a releasing film at upper and lower surfaces of a center layer and attaching a first metal film to each of the releasing films and a resist layer to each of the first metal films to form a base member. A first connection portion may then be formed on each of the first metal films, and a second connection portion may be integrally formed on each of the first connection portions. A second metal film may then be formed on each of the second connection portions so as to be electrically connected to the connection portions, and, in turn, to the first metal films. Specific portions of the second metal films may be etched to form copper patterns. Upper and lower portions may then be separated by the releasing films to form separate multi-layer printed circuit boards.
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Chinese Office Action w/ English Translation.
Eo Tae-Sik
Han Joon-Wook
Hwang Jung-Ho
Lee Sang-Min
Lee Sung-Gue
Fleshner & Kim LLP
LG Electronics Inc.
Nguyen Nam
Van Luan V.
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