Multi-layer printed circuit board and a BGA semiconductor...

Details Multi-layer printed circuit board and a BGA semiconductor... Multi-layer printed circuit board and a BGA semiconductor...

2005-04-26

2005-04-26

Cuneo, Kamand (Department: 2827)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S264000, C029S830000, C029S832000

Reexamination Certificate

active

06884945

ABSTRACT:
A multi-layer printed circuit board on which insulation resin layers and circuit pattern layers are alternatively stacked to form multiple layers, including: an insulation resin layer; a circuit pattern formed at the upper surface of the insulation resin layer; a blind via hole formed penetrating the insulation resin layer and the circuit pattern; a plated layer formed at the upper surface of the circuit pattern, at the inner wall face and the bottom of the blind via hole; an inner lead bump pad formed at the surface of the plated layer which is exposed to the lower surface of the insulation resin layer; and an outer lead bump pad formed on the circuit pattern which is formed at the upper surface of the insulation resin layer, whereby the problem of defective attachment of a bump due to a void present in a blind via hole is eliminated.

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