Multi-layer printed board

Details Multi-layer printed board Multi-layer printed board

2005-11-29

2005-11-29

Cuneo, Kamand (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S262000, C361S794000

Reexamination Certificate

active

06969808

ABSTRACT:
A multi-layer printed board including signal layers, each signal layer including a signal line, a through-hole, and a ground through-hole. The signal layer includes a land connecting the through-hole and the signal line. An external periphery of the land has a first portion farthest from a center of the land, and a second portion extending a shorter distance from the center of the land than the first portion. A portion of the external periphery of the land opposite to the ground through-hole closest to the center of the land is the second portion. Consequently, impedance matching can be improved even if a signal frequency is high.

REFERENCES:
patent: 6201305 (2001-03-01), Darveaux et al.
patent: 6700789 (2004-03-01), Shirasaki
patent: 6794961 (2004-09-01), Nagaishi et al.
patent: 6828513 (2004-12-01), Kistner
patent: 2002/0036099 (2002-03-01), Hachiya
patent: 11-54869 (1999-02-01), None
patent: 2000-216510 (2000-08-01), None
patent: 2002-111230 (2002-04-01), None

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