Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond
Patent
1989-01-27
1990-02-20
Powell, William A.
Stock material or miscellaneous articles
Structurally defined web or sheet
Discontinuous or differential coating, impregnation or bond
29846, 156630, 156634, 156656, 1566591, 156666, 156902, 174 685, 428416, 428601, 428626, B32B 300, H05K 100, B44C 122, C23F 102
Patent
active
049025562
ABSTRACT:
Multi-layer laminates are provided of alternating or non alternating layers of reinforced epoxy and reinforced polynorbornene. The laminates are made by a process which includes an adhesion promotion step wherein at least one of the layers, prior to lamination, is pretreated with an adhesion promotion agent. Preferred adhesion promotion agents include silanes. One or more layers of copper foil can also be employed between exterior surfaces of the layers at the interface between the layers, as well as on the exterior of the laminates. The copper films can be etched to form patterns such as those suitable for printed circuit wiring boards.
REFERENCES:
patent: 3318758 (1967-05-01), Tell
patent: 3508983 (1970-04-01), Origer et al.
patent: 3558423 (1971-01-01), Rossetti, Jr.
patent: 4315970 (1982-02-01), McGee
patent: 4358479 (1982-11-01), Canestaro et al.
patent: 4372800 (1983-02-01), Oizumi et al.
patent: 4389268 (1983-06-01), Oshima et al.
patent: 4428095 (1984-01-01), Frisch et al.
patent: 4451317 (1984-05-01), Oizumi et al.
patent: 4571279 (1986-02-01), Oizumi et al.
patent: 4639285 (1987-01-01), Suzuki et al.
Chemical Abstract No. 72:124634r, "Hybrid Polyimide/Epoxy Glass Multilayer Fabrication".
Chemical Abstract No. 98:162024m, "Metal-Covered Laminates".
Chemical Abstract No. 98:162025n, "Metal-Covered Laminates".
Chemical Abstract No. 98:162026p, "Metal-Covered Laminates".
Chemical Abstract No. 105:135048d, "Multi-Layer Circuit Boards".
Chemical Abstract No. 107:97841p, "Polycyclic Olefin Laminated Boards".
Chemical Abstract No. 107:8574p, "Epoxy Prepregs for Printed-Wiring Boards".
Chemical Abstract No. 107:8575q, "Epoxy Prepregs for Printed-Wiring Boards".
WPI No. 83-00996K/01, "Metal Glass Laminated Plate Manufacture Using Adhesive Comprising Silyl-Modified Organic Polymer".
WPI No. 83-759725/37, "Bonding Copper Foil to Backing Material Using Silane Compound as Adhesion Promoter; PCB Print Circuit Board".
WPI No. 74-34559V/19, "Metallised Plastic Substrate, e.g., Electronic Circuit--By Laminating Pretreated Metal Sheet with Plastic Substrate, Removing Metal Layer, and Metallising Exposed Surface".
WPI No. 85-162927/27, "Copper Coated Laminated Plate Production for PCB, Using Unsaturated Resin, e.g., Polyester or Vinyl Ester to Impregnate Base Material".
"Today's Substrates", Murray, Circuits Manufacturing, Nov. 1987, p. 25.
"G-10FR Epoxy/Glass Fabric General Purpose Laminate", Norplex, Product Bulletin.
"Adhesion in Mineral-Organic Composites", D. M. Brewis, D. Briggs, John Wiley & Sons, Industrial Adhesion Problems, Chapter 6.
The Kirk-Othmer Encyclopedia of Chemical Technology, John Wiley & Sons, 1982, vol. 20.
Aleksa David M.
Benedikt George M.
Powell William A.
The B. F. Goodrich Company
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