Multi-layer polyimide films and flexible circuit substrates...

Details Multi-layer polyimide films and flexible circuit substrates... Multi-layer polyimide films and flexible circuit substrates...

2005-06-29

2008-11-18

Woodward, Ana L (Department: 1796)

Stock material or miscellaneous articles

Composite

Of metal

C428S473500

Reexamination Certificate

active

07452610

ABSTRACT:
A multi-layer polyimide film including two or more laminated polyimide film layers is provided, with at least one of the two or more polyimide film layers is obtained by imidizing a polyamic acid derived from the reaction of at least one aromatic diamine containing 1-100 mol percent of carboxy-4,4′-diaminobiphenyl represented by the following formula,wherein m and n represent integers of 4 or less, including 0, and (m+n) is an integer of 1 or greater, and at least one aromatic tetracarboxylic dianhydride or a derivative thereof. Methods for obtaining a multi-layer polyimide film laminate can exhibit a peel strength of 10N/cm when laminated to a metal foil using an adhesive and can have a water absorption value of less than 3.0 weight percent.

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