Multi-layer polishing pad material for CMP

Details Multi-layer polishing pad material for CMP Multi-layer polishing pad material for CMP

2005-04-26

2005-04-26

Nguyen, Dung Van (Department: 3723)

Abrading

Flexible-member tool, per se

Laminate

C451S530000, C451S527000

Reexamination Certificate

active

06884156

ABSTRACT:
The invention is directed to a multi-layer polishing pad for chemical-mechanical polishing comprising a polishing layer and a bottom layer, wherein the polishing layer and bottom layer are joined together without the use of an adhesive. The invention is also directed to a polishing pad comprising an optically transmissive multi-layer polishing pad material, wherein the layers of the polishing pad material are joined together without the use of an adhesive.

REFERENCES:
patent: 3504457 (1970-04-01), Jacobsen
patent: 3581439 (1971-06-01), Jensen, Jr.
patent: 5257478 (1993-11-01), Hyde et al.
patent: 5605760 (1997-02-01), Roberts
patent: 5893796 (1999-04-01), Birang et al.
patent: 6007407 (1999-12-01), Rutherford et al.
patent: 6089963 (2000-07-01), Wiand et al.
patent: 6171181 (2001-01-01), Roberts et al.
patent: 6328642 (2001-12-01), Pant et al.
patent: 6358130 (2002-03-01), Freeman et al.
patent: 6425816 (2002-07-01), Roberts et al.
patent: 6524164 (2003-02-01), Tolles
patent: 6524176 (2003-02-01), Cheng et al.
patent: 20020111120 (2002-08-01), Goetz
patent: 20020115385 (2002-08-01), Misra et al.
patent: 20030129931 (2003-07-01), Konno et al.

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