Multi-layer plated lead frame

Details Multi-layer plated lead frame Multi-layer plated lead frame

1998-02-19

2000-11-21

Guay, John

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

Of specified material other than copper

257766, H01L 23495

Patent

active

061507113

ABSTRACT:
A multi-layer plated lead frame is provided. The lead frame has a structure in which a first precious metal plating layer, an intermediate plating layer, and a second precious metal plating layer are sequentially formed on a substrate made of ferroalloy. The lead frame shows improvement in all properties including wire bonding, anti-corrosion, and solderability.

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