Optical waveguides – Integrated optical circuit
Reexamination Certificate
2005-12-20
2005-12-20
Healy, Brian (Department: 2883)
Optical waveguides
Integrated optical circuit
C385S053000, C385S088000, C385S129000, C385S130000, C385S131000
Reexamination Certificate
active
06978058
ABSTRACT:
The present invention discloses a multi-layer Printed Circuit Board (PCB) and method for coupling block type multichannel optical signals, the method including the steps of i) forming one or more first optical via holes to allow one or more first optical signal coupling blocks to be inserted therein, ii) aligning a first optical waveguide and the first optical signal coupling blocks so that the first optical waveguide is interconnected to the first optical signal coupling blocks via an optical signal, iii) attaching a first fixing guide to a base board to fasten the first optical signal coupling blocks, iv) removing the first fixing guide and forming one or more second optical via holes to allow one or more second optical signal coupling blocks to be inserted therein, and v) repeatedly performing steps i) to iv) as many times as a number of layers of the multi-layer PCB.
REFERENCES:
patent: 5652811 (1997-07-01), Cook et al.
patent: 6257771 (2001-07-01), Okayasu
patent: 6516105 (2003-02-01), Khusid et al.
patent: 2001-113289 (2001-07-01), None
Cho Young-Sang
Kim Young-Woo
Rhee Byoung-Ho
Yang Dek-Gin
Yim Kyu-Hyok
Gottlieb Rackman & Reisman P.C.
Healy Brian
Samsung Electro-Mechanics Co. Ltd.
Wong Eric
LandOfFree
Multi-layer PCB and method for coupling block type... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Multi-layer PCB and method for coupling block type..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multi-layer PCB and method for coupling block type... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3496772