Multi-layer parison forming apparatus and process

Details Multi-layer parison forming apparatus and process Multi-layer parison forming apparatus and process

1989-10-27

1991-12-10

Thurlow, Jeffery

Plastic and nonmetallic article shaping or treating: processes

With measuring, testing, or inspecting

Controlling rate of movement of molding material or its...

264515, 264167, 264173, 4251331, 425149, 425166, 425170, 425381, 425462, 425532, B29C 4792

Patent

active

050716042

ABSTRACT:
A multi-layer parison has a plurality of layers of main and auxiliary resins laminated with each other. An apparatus for forming the multi-layer parison includes a main resin extruding mechanism, at least one auxiliary resin extruding mechanism and a control unit for controlling the main and auxiliary resin extruding mechanisms so that the pressure for extruding the auxiliary resin is immediately increased and the pressure for extruding the main resin is gradually increased at the beginning of extrusion of the main and auxiliary resins.

REFERENCES:
patent: 3724985 (1973-04-01), Burlis et al.
patent: 4056344 (1977-11-01), Lemelson
patent: 4179251 (1979-12-01), Hess et al.
patent: 4217635 (1980-08-01), Handte et al.
patent: 4522775 (1985-06-01), Briggs et al.
patent: 4563147 (1986-01-01), Langecker
patent: 4717326 (1988-01-01), Motonaga et al.
patent: 4758144 (1988-07-01), Becker
patent: 4798526 (1989-01-01), Briggs et al.
patent: 4824618 (1989-04-01), Strum et al.
patent: 4867664 (1989-09-01), Fukuhara
patent: 4907957 (1990-03-01), Nakagawa et al.

Affiliated with

Also associated with

Rating

Multi-layer parison forming apparatus and process does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multi-layer parison forming apparatus and process, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multi-layer parison forming apparatus and process will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1038940