Multi-layer panel board with single-in-line package for high sp

Details Multi-layer panel board with single-in-line package for high sp Multi-layer panel board with single-in-line package for high sp

1975-04-24

1977-01-18

Smith, Jr., David

H05K 500

Patent

active

040041964

ABSTRACT:
A multi-layer panel employing a resistor-terminator module in the form of a single-in-line package located adjacent conventional dual-in-line packages, with interconnections to be made by means of wire wrapping. The resistors in the single-in-line package have one common lead electrically connected to a conductive layer in the panel. Conductive layer surface areas are maximized for improved signal transmission characteristics.

REFERENCES:
patent: 3891898 (1975-06-01), Damon

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