Multi-layer package-on-package system

Details Multi-layer package-on-package system Multi-layer package-on-package system

2011-07-12

2011-07-12

Mandala, Victor (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257SE21502, C257SE23169, C438S109000

Reexamination Certificate

active

07977780

ABSTRACT:
A package-on-package system includes: providing a bottom package module incorporating a bottom package substrate; attaching a central internal stacking module, incorporating a central interposer, on top of the bottom package module; placing a spacer on the top surface of the central internal stacking module; mounting a first top package module, incorporating a first top interposer with an opening, on the spacer; and enclosing at least portions of the bottom package module, the central internal stacking module, and the first top package module with an encapsulant.

REFERENCES:
patent: 7354800 (2008-04-01), Carson
patent: 2006/0043559 (2006-03-01), Chow et al.
patent: 2007/0001296 (2007-01-01), Lee et al.
patent: 2007/0181990 (2007-08-01), Huang et al.
patent: 2008/0131999 (2008-06-01), Takiar et al.
patent: 2008/0157325 (2008-07-01), Chow et al.
patent: 2009/0273094 (2009-11-01), Ha et al.

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