Multi-layer-multi-chip pyramid and circuit board structure and m

Details Multi-layer-multi-chip pyramid and circuit board structure and m Multi-layer-multi-chip pyramid and circuit board structure and m

1998-01-08

1999-06-01

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

2281791, 22818021, 22818022, 361735, 361743, 361744, 361746, H05K 336

Patent

active

059079037

ABSTRACT:
The present invention provides multi-layer multi-chip circuit board comprising at least two ATAB carriers having chips thereon, stacked upon each other in a pyramid configuration and attached to a substrate, thus reducing the required area on the substrate for mounting components to form a circuit board.

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