Multi-layer, multi-chip pyramid and circuit board structure

Details Multi-layer, multi-chip pyramid and circuit board structure Multi-layer, multi-chip pyramid and circuit board structure

1996-05-24

1998-02-03

Sparks, Donald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

257686, 361803, H01R 2368, H05K 111

Patent

active

057151440

ABSTRACT:
The present invention provides multi-layer multi-chip circuit board comprising at least two ATAB carriers having chips thereon, stacked upon each other in a pyramid configuration and attached to a substrate, thus reducing the required area on the substrate for mounting components to form a circuit board.

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