Multi-layer metal connecting contact and method for making it

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Details

357 67, 357 73, H01L 2348

Patent

active

041422023

ABSTRACT:
A multi-layer metal connecting contact on a semiconductor body of a predetermined conductivity type comprises three gold layers on the semiconductor body, one on top of the next, with the middle layer containing an impurity material which produces the predetermined type of conductivity in said semiconductor body, and at least one further metal layer not comprising gold arranged on said gold layers.
The invention also includes a method of making such a multi-layer metal connecting contact.

REFERENCES:
patent: 3523223 (1970-08-01), Luxem et al.
patent: 3850688 (1974-11-01), Halt

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