Multi layer low cost cavity substrate fabrication for pop...

Details Multi layer low cost cavity substrate fabrication for pop... Multi layer low cost cavity substrate fabrication for pop...

2007-05-17

2009-12-22

Potter, Roy K (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257SE23007, C257S737000

Reexamination Certificate

active

07635914

ABSTRACT:
In a method and system for fabricating a semiconductor device (100) having a package-on-package structure, a base laminate substrate (BLS) (110) is formed to include a base center portion (112) and a peripheral portion (114) separated by a barrier element (120). The barrier element (120) forms a peripheral wall (118) to surround the base center portion (112). A frame shaped top laminate substrate (TLS) (130) is disposed over the peripheral portion (114) of the BLS (110). The TLS (130) has an open top center portion (132) matching the base center portion (112) surrounded by the peripheral wall (118) to form a cavity (140). A plurality of conductive bumps (150) each disposed between a top contact pad (134) of the TLS and a base contact pad (116) of the peripheral portion (114) of the BLS (110) are formed to provide electrical and mechanical coupling therebetween. The barrier element (120) forms a seal between the cavity (140) and the plurality of conductive bumps (150).

REFERENCES:
patent: 5858816 (1999-01-01), Sato et al.
patent: 6084297 (2000-07-01), Brooks et al.
patent: 6277672 (2001-08-01), Ho
patent: 2003/0209465 (2003-11-01), Shoji
patent: 2006/0170092 (2006-08-01), Kim et al.
patent: 2007/0059918 (2007-03-01), Jung et al.

Affiliated with

Also associated with

Rating

Multi layer low cost cavity substrate fabrication for pop... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multi layer low cost cavity substrate fabrication for pop..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multi layer low cost cavity substrate fabrication for pop... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4148092