Multi-layer leadframes, electrically conductive plates used ther

Details Multi-layer leadframes, electrically conductive plates used ther Multi-layer leadframes, electrically conductive plates used ther

1991-09-25

1993-10-05

Hille, Rolf

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257669, 257674, H01L 2348, H01L 2350

Patent

active

052508390

ABSTRACT:
A multi-layer leadframe according to this invention is formed by laminating on a leadframe body an insulating layer and an electrically conductive layer in this order. The electrically conductive plate includes a planar portion and a given number of terminal portions extending therefrom, said planar portion extending across said insulating layer laminated on said leadframe body. The planar portion is made thinner than the terminal portions. A thin portion of this planar portion is formed by an etching technique, and at least a part of the terminal portions of the electrically conductive plate is fixedly connected with an inner lead of the leadframe body.

REFERENCES:
patent: 4796078 (1989-01-01), Phelps, Jr. et al.
patent: 4994936 (1991-02-01), Hernandez
"Plane Electrical Enhancement"-IBM Technical Disclosure Bulletin-vol. 32 No. 10A Mar. 1990, pp. 85-86.

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