Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent
1989-10-30
1991-06-18
Picard, Leo P.
Electricity: conductors and insulators
Boxes and housings
Hermetic sealed envelope type
357 70, 357 74, H01L 2302
Patent
active
050251147
ABSTRACT:
A composite leadframe is provided. The leadframe comprises a rigid metal portion electrically interconnected to a flexible multi-layer portion. When sealed within an electronic package, the composite leadframe provides a higher lead density than achieved by rigid metal leadframes and better electrical and mechanical properties than achieved with flexible leads. The package may comprise a discrete base and cover component with the leadframe disposed between or a monolithic block of plastic encapsulating the electronic device and a portion of the leadframe.
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"Introducing Intel's MM Multi-Layer Molded High Performance, PQFP, 1989", Section 2.
Ledynh Bot L.
Olin Corporation
Picard Leo P.
Rosenblatt Gregory S.
Weinstein Paul
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