Multi-layer lead frame for a semiconductor device

Details Multi-layer lead frame for a semiconductor device Multi-layer lead frame for a semiconductor device

1993-05-26

1995-03-21

Nimmo, Morris H.

Electricity: conductors and insulators

Conduits, cables or conductors

Combined

174 524, 174 88R, 174261, 257690, H05K 100, H01L 2302

Patent

active

053998090

ABSTRACT:
A multi-layer lead frame for a semiconductor device includes a signal layer made of a metal strip having a signal pattern including a plurality of lead lines. A power supply or ground layer is adhered and laminated to the signal layer by means of an adhesive film. The adhesive film is an electrically insulation connector tape having through holes extending in a thickness direction. Conductive metal vias are filled in the through holes for electrically connecting the power supply or ground layer particular leads among the plurality of lead lines.

REFERENCES:
patent: 3597834 (1971-08-01), Lathrop et al.
patent: 3848077 (1974-11-01), Whitman
patent: 4113981 (1978-09-01), Fujita et al.
patent: 4925024 (1990-05-01), Ellenberger et al.
patent: 5025114 (1991-06-01), Braden
patent: 5180888 (1993-01-01), Sugiyama et al.
patent: 5183969 (1993-02-01), Odeshima
patent: 5262226 (1993-11-01), Yoshida
IBM Technical Disclosure Bulletin, vol. 33, No. 10A, Mar. 1991, New York, NY, "Flatpack Package Using Core Metal Layer of Composite Substrate as Ground Plane," pp. 450-451.

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