Multi-layer laminate molding

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Details

428 357, 428213, 525193, 525240, B29D22/00

Patent

active

059026553

ABSTRACT:
There is disclosed a multi-layer laminate molding having a layer structure that a main material layer made mainly of a polyethylenic resin at the outer side and an ethylene-vinyl acetate copolymer saponified product layer or polyamide resin layer at the inner side are laminated through at least an adhesive material layer, the adhesive material layer comprising a resin composition containing (A) 60 to 95% by weight of at least one resin selected from the-group consisting of (1) a high density polyethylenic resin having specified physical properties, (2) a linear low density polyethylenic resin having specified physical properties, (3) a modified high density polyethylenic resin obtained by grafting unsaturated carboxylic acid and the like onto the above (1), and (4) a modified linear low density polyethylenic resin obtained by grafting unsaturated carboxylic acid and the-like onto the above (2), and containing at least 0.1% by weight of (3) and/or (4) and (B) 40 to 5% by weight of a linear ultra low density polyethylenic resin having specified, physical properties said resin composition having a proportion of the unsaturated carboxylic acid and the like grafted of 0.001 to 50% by weight, the difference in acoustic impedance between the main material layer and adhesive material layer being at least 8.5.times.10.sup.-3 g/cm.sup.2 .multidot..mu.sec. This multi-layer laminate molding is excellent in barrier properties, and non-destructive detection of the adhesive material layer can be carried out easily by the supersonic wave reflection method.

REFERENCES:
patent: 5045401 (1991-09-01), Tabor et al.
patent: 5073420 (1991-12-01), Yano et al.
patent: 5305239 (1994-04-01), Kinra

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