Multi-layer laminate and method of producing same

Details Multi-layer laminate and method of producing same Multi-layer laminate and method of producing same

1999-03-26

2000-08-15

Gulakowski, Randy

Etching a substrate: processes

Forming or treating electrical conductor article

Adhesive or autogenous bonding of self-sustaining preforms

216 33, 156151, 156324, H05K 336

Patent

active

061031356

ABSTRACT:
A method of forming a multi-layer laminate from a plurality of individual laminates comprised of copper clad on a polyimide.

REFERENCES:
patent: 4411982 (1983-10-01), Shibuya et al.
patent: 4814855 (1989-03-01), Hodgson et al.
patent: 5242562 (1993-09-01), Beyerle et al.
patent: 5589280 (1996-12-01), Gibbons et al.
patent: 5603158 (1997-02-01), Murata et al.
patent: 5638597 (1997-06-01), Cutting et al
patent: 5681443 (1997-10-01), Ameen et al.
patent: 5685970 (1997-11-01), Ameen et al.

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