Multi-layer interconnect sutructure for ball grid arrays

Details Multi-layer interconnect sutructure for ball grid arrays Multi-layer interconnect sutructure for ball grid arrays

1996-12-02

1998-12-01

Ledynh, Bot

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

257693, 257779, 257783, H01L 2302

Patent

active

058441689

ABSTRACT:
A ball grid array (BGA) package is provided in which the stiffener of the BGA may also be utilized as a conductive layer. A TAB tape is adhered to the stiffener by an adhesive and both the TAB tape and the adhesive may have vias which open to the stiffener. Conductive plugs which may be formed of solder paste, conductive adhesives, or the like may then be filled in the vias to provide electrical connection from the TAB tape to the stiffener. The vias may be located adjacent to solder ball locations. The TAB tape may include multiple conductor layers or multiple layers of single conductive layer TAB tape may be stacked upon each other to provide additional circuit routing. Further, the TAB tape layers may also be combined with the use of metal foil layers.

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