Multi-layer integrated circuit package

Details Multi-layer integrated circuit package Multi-layer integrated circuit package

2005-05-31

2005-05-31

Vinh, Lan (Department: 1765)

Etching a substrate: processes

Forming or treating electrical conductor article

C216S017000, C216S018000, C438S112000

Reexamination Certificate

active

06899815

ABSTRACT:
Adhesive material is applied to a surface of a metallic core layer. The adhesive material is removed from a conductive region of the metallic core layer. A metallic contact is provided over the conductive region of the metallic core layer. The metallic core layer is laminated to an imprinted buildup layer, the buildup layer having a dielectric region and a conductive region, wherein a nonconductive region of the metallic core layer is bonded to the dielectric region of the buildup layer and the conductive region of the metallic core layer is bonded to the conductive region of the imprinted-buildup layer.

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