Multi-layer insulated metal substrate printed wiring board havin

Details Multi-layer insulated metal substrate printed wiring board havin Multi-layer insulated metal substrate printed wiring board havin

1999-10-14

2000-12-26

Lam, Cathy

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

174250, 174255, 174256, 361795, 361803, 257685, 257686, B32B 300, H05K 103, H05K 111, H01L 2302

Patent

active

061655961

ABSTRACT:
An insulated metal substrate printed wiring board includes a thermally conductive base plate. A first dielectric layer is disposed on the base plate. An electrically conductive trace is disposed on the top surface of the first dielectric layer. A second dielectric layer is disposed on the top surface of the first electrically conductive trace. A second electrically conductive trace is disposed on the top surface of the second dielectric layer. The second dielectric layer and the second electrically conductive trace include an aperture to expose the electrically conductive trace disposed on the top surface of the first dielectric layer. High power dissipating components are mounted through the aperture in the second electrically conductive layer and second dielectric layer for electrical connection to the electrically conductive trace disposed on the top surface of the first dielectric layer. Similar construction can be extended to more than two layers of electrically conductive traces and the aperture is through all the layers except the first dielectric layer and the first electrically conductive layer.

REFERENCES:
patent: 4574879 (1986-03-01), DeGree et al.
patent: 4602678 (1986-07-01), Fick
patent: 4810563 (1989-03-01), DeGree et al.
patent: 5784782 (1998-07-01), Boyko et al.
patent: 5969945 (1999-10-01), Cutting et al.

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