Multi-layer identification card

Details Multi-layer identification card Multi-layer identification card

1985-08-19

1986-10-14

McCamish, Marion C.

Stock material or miscellaneous articles

Nonparticulate element embedded or inlaid in substrate and...

40625, 235488, 428 76, 428138, 428203, 428901, 428916, B60J 100

Patent

active

046172165

ABSTRACT:
An identification card equipped with an integrated circuit, in which the circuit along with its connection leads is arranged on a carrier element which is embeddedly enclosed by the card on all sides by use of the hot lamination technique. In order to protect the sensitive arrangement, the carrier element is subjected to the full laminating pressure only when one or more layers in the card construction have softened.
This is achieved, for example, by providing buffer zones in the card laminate at least in the area of the arrangement in the form of cavities or layers that are easy to deform elastically. The buffer zones protect the arrangement from local pressure peaks in the initial phase of the laminating process. It is also possible to control the laminating pressure as a function of the temperature or the degree of softening of the card layers.

REFERENCES:
patent: 3274722 (1966-09-01), Kollar et al.
patent: 3411981 (1968-11-01), Thomas
patent: 3417497 (1968-12-01), Hannon
patent: 3702464 (1972-11-01), Castrucci
patent: 3811977 (1974-05-01), Kramer
patent: 3871945 (1975-03-01), Winrow et al.
patent: 4216577 (1980-08-01), Badet et al.
patent: 4222516 (1980-09-01), Badet et al.
patent: 4330350 (1982-05-01), Andrews

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