Multi-layer gate stack

Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S710000, C252S079100, C252S079400

Reexamination Certificate

active

10314380

ABSTRACT:
A method of making a semiconductor structure, comprises etching a nitride layer with a plasma to form a patterned nitride layer. The nitride layer is on a semiconductor substrate, a photoresist layer is on the nitride layer, and the plasma is prepared from a gas mixture comprising CF4and CHF3at a pressure of at least 10 mTorr.

REFERENCES:
patent: 5721090 (1998-02-01), Okamoto et al.
patent: 5817579 (1998-10-01), Ko et al.
patent: 6087063 (2000-07-01), Hada et al.
patent: 6107135 (2000-08-01), Kleinhenz et al.
patent: 6258677 (2001-07-01), Ang et al.
patent: 6342452 (2002-01-01), Coronel et al.
patent: 6451647 (2002-09-01), Yang et al.
patent: 6624068 (2003-09-01), Thakar et al.
patent: 6635185 (2003-10-01), Demmin et al.
patent: 6897120 (2005-05-01), Trapp
patent: 2001/0014512 (2001-08-01), Lyons et al.
patent: 2002/0102782 (2002-08-01), Oshima
patent: 2004/0110387 (2004-06-01), Chowdhury
U.S. Appl. No. 10/186,453, filed Jun. 28, 2002.
U.S. Appl. No. 10/185,646, filed Jun. 28, 2002.
U.S. Appl. No. 10/313,049, filed Dec. 6, 2002.
U.S. Appl. No. 10/313,267, filed Dec. 6, 2002.
U.S. Appl. No. 10/313,283, filed Dec. 6, 2002.
U.S. Appl. No. 10/313,048, filed Dec. 6, 2002.
Encyclopedia of Chemical Technology, Kirk-Othmer, vol. 14, pp. 677-709 (1995).
Diaz, C.H., H. Tao, Y. Ku, A. Yen, and K. Young, 2001. “An Experimemtally Validated Analytical Model For Gate Line-Edge Roughness (LER) Effects on Technology Scaling”, IEEE Electron Device Letters, 22(6)287-289.
Diaz, et al., An Experimentally Validated Analytical Model For Gate Line-Edge Roughness (LER) Effects on Technology Scaling, IEEE Electron Device Letters, vol. 22, No. 6, pp. 287-289, Jun. 2001.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Multi-layer gate stack does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multi-layer gate stack, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multi-layer gate stack will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3865929

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.