Multi-layer flexible printed circuit and method of making same

Details Multi-layer flexible printed circuit and method of making same Multi-layer flexible printed circuit and method of making same

1993-04-12

1994-10-11

Gensler, Paul

Wave transmission lines and networks

Long lines

Strip type

156182, 156297, 1563066, 257691, 333247, H01P 308

Patent

active

053551052

ABSTRACT:
A novel multi-layer flexible printed circuit for tape automated bonding (TAB) is assembled from three components during the process of TAB bonding the circuit to a semiconductor device for burn in and testing prior to assembly into a system comprising a plurality of tested TAB circuit bonded devices. The first layer comprises a conductive signal plane layer mounted on top of a flexible dielectric layer. The second layer comprises a dielectric spacer layer mounted on top of the conductive signal plane layer. The third layer comprises a conductive ground plane layer mounted on the bottom of a dielectric layer. The conductive ground plane layer is mounted on top of the dielectric spacer layer. Before testing, the inner leads of the composite multi-layer circuit are bonded to the electrode pads of a semiconductor device to be tested. After testing the outer portions of the TAB circuit are cut away leaving the outer leads exposed. The semiconductor device is then connected to its carrier circuit by bonding the outer leads of the tested TAB circuit to the leads of a carrier circuit or package.

REFERENCES:
patent: 3612744 (1971-10-01), Thomas
patent: 4916417 (1990-04-01), Ishikawa et al.
patent: 4926007 (1990-05-01), Aufderheide et al.
patent: 5237201 (1993-08-01), Tanaki et al.
High Performance Printed Circuits Made With Low Dielectric Materials, IBM Tech. Discl. Bulletin, vol. 32, No. 3B, Aug. '89, pp. 237, 238.

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