Multi-layer flexible film module

Details Multi-layer flexible film module Multi-layer flexible film module

1982-12-27

1984-10-30

Powell, William A.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

29846, 156644, 156650, 156656, 156902, 174 685, 264104, H05K 100, C23F 102, B44C 122, C03C 1500

Patent

active

044802889

ABSTRACT:
A high density electronic circuit module which includes a thin flexible film chip carrier having circuitry on both sides thereof. The double-sided thin, flexible circuitry is fabricated by depositing a first layer of chrome-copper-chrome circuitry on an aluminum substrate. This first layer of chrome-copper-chrome circuitry is covered with a layer of polyimide. Vias are etched into the polyimide. Next, a second layer of chrome-copper-chrome circuitry is deposited on top of the polyimide. The first and second layers of circuitry are connected through the etched vias. Finally, hydrochloric acid is utilized to etch away the aluminum substrate carrier. It is noted that hydrochloric acid etches aluminum whereas it does not etch chrome-copper-chrome circuitry.

REFERENCES:
patent: 3823467 (1974-07-01), Shamash et al.
patent: 3838984 (1974-10-01), Crane et al.

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