Special receptacle or package – For tacky material
Reexamination Certificate
2008-04-01
2008-04-01
Gehman, Bryon P (Department: 3728)
Special receptacle or package
For tacky material
C053S440000, C206S524200
Reexamination Certificate
active
10274827
ABSTRACT:
Multi-layer films are used to package hot melt adhesives. The packaging film does not require removal prior to use of the adhesive. Multi-layer films wherein at least one layer has a melting point below about 100° C. is used to package low application temperature hot melt adhesives.
REFERENCES:
patent: 3314536 (1967-04-01), Janota et al.
patent: 5674944 (1997-10-01), Falla et al.
patent: 5789048 (1998-08-01), Flieger
patent: 5804610 (1998-09-01), Hamer et al.
patent: RE36177 (1999-04-01), Rouyer et al.
patent: 5987852 (1999-11-01), Bozich et al.
patent: 6044625 (2000-04-01), Waver et al.
patent: 6138441 (2000-10-01), Kik et al.
patent: 6230890 (2001-05-01), Waver et al.
patent: 0 699 586 (1996-03-01), None
patent: 2 544 654 (1984-10-01), None
patent: WO 99/33704 (1999-07-01), None
patent: WO 00/09401 (2000-02-01), None
patent: WO 02/061009 (2002-08-01), None
Haner Dale L.
Harwell Michael G.
Ryan Leisa A.
Foulke Cynthia L.
Gehman Bryon P
National Starch and Chemical Investment Holding Corporation
LandOfFree
Multi-layer film packaging of hot melt adhesive does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Multi-layer film packaging of hot melt adhesive, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multi-layer film packaging of hot melt adhesive will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3953417