Multi-layer electrodeposition coating film-forming method...

Details Multi-layer electrodeposition coating film-forming method... Multi-layer electrodeposition coating film-forming method...

2006-07-18

2006-07-18

Mayekar, Kishor (Department: 1753)

Chemistry: electrical and wave energy

Processes and products

Electrophoresis or electro-osmosis processes and electrolyte...

C204S505000, C204S506000, C523S415000

Reexamination Certificate

active

07077941

ABSTRACT:
A multi-layer electrodeposition coating film-forming method which comprises subjecting a cationic electrodeposition coating composition containing at least two emulsions to an electrodeposition coating, said cationic electrodeposition coating composition being such that a difference in an electrical quantity (a) required for deposition starting between a first coating composition comprising a first emulsion and a second coating composition comprising a second emulsion in two emulsions selected from the at least two emulsions is in the range of 50 to 400 C/m2.

REFERENCES:
patent: 4840715 (1989-06-01), Misawa et al.
patent: 4981759 (1991-01-01), Nakatani et al.
patent: 5185065 (1993-02-01), Chung et al.
patent: 6248225 (2001-06-01), Palaika et al.
patent: 6423425 (2002-07-01), Faucher et al.
patent: 6673853 (2004-01-01), Muramoto et al.
patent: 174277/87 (1987-07-01), None
patent: 333528/96 (1996-12-01), None
patent: 292131/98 (1998-11-01), None
patent: 345394/00 (2000-12-01), None
patent: 234116/01 (2001-08-01), None
A copy of the European Search Report from applicant's corresponding patent application, May 2004.

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