Multi-layer electrical support substrate

Details Multi-layer electrical support substrate Multi-layer electrical support substrate

1984-10-17

1986-11-25

Edlow, Martin H.

357 71, 357 67, 357 68, 357 65, H01L 2348

Patent

active

046252282

ABSTRACT:
To prevent defoliation or splitting-off of an aluminum or aluminum alloy which is roll-plated on a copper or copper alloy base, an intermediate nickel layer having less than 0.05% contaminants is applied beneath the aluminum layer. If the base is a copper alloy, an intermediate copper layer which is of an oxygen-free copper or copper alloy is placed between the base and the nickel layer. Typical dimensions are: base copper layer (1, 13): 0.25 mm; oxygen-free copper layer (7, 15): 0.005 to 0.01 mm; nickel layer with less than 0.05% contaminants or impurities: about 0.01 mm; AlSi 0.5 aluminum alloy: 0.005 to 0.006 mm.

REFERENCES:
patent: 3252722 (1966-05-01), Allen
patent: 3551997 (1971-01-01), Etter
patent: 3576415 (1971-04-01), Gwyn, Jr.
patent: 4000842 (1977-01-01), Burns
patent: 4151545 (1979-04-01), Schnepf et al.
d'Heurle et al, IBM Tech. Discl. Bull., vol. 19, No. 8, Jan. 1977, p. 3233.

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