Multi-layer electrical interconnection structures and fabricatio

Details Multi-layer electrical interconnection structures and fabricatio Multi-layer electrical interconnection structures and fabricatio

1995-02-10

1997-03-18

Picardat, Kevin

Fishing, trapping, and vermin destroying

437211, 437214, 437215, 437217, H01L 2160

Patent

active

056122560

ABSTRACT:
A flat-panel field emission display comprises a luminescent faceplate, a rigid backplate, and an interposed or sandwiched emitter or cathode plate. A dielectric connector ridge is screen-printed over the faceplate's rear surface. Upper and lower level conductors are then screen printed over the faceplate. The lower-level conductors are applied directly on the faceplate rear surface. The upper-level conductors are applied atop the connector ridge. A plurality of bond wire interconnections extend between individual screen-printed conductors of the upper and lower levels. The bond wire interconnections create inter-level electrical interconnections between said individual screen-printed conductors. The cathode plate is positioned over the connector ridge. The cathode plate has a plurality of die bond pads facing the faceplate rear surface and aligned with the upper-level conductors. A plurality of conductive bonds such as flip-chip connections are positioned between the die bond pads and the facing upper-level conductors.

REFERENCES:
patent: 4387283 (1983-06-01), Peterson et al.
patent: 4423435 (1983-12-01), Test, II
patent: 4769345 (1988-09-01), Butt et al.
patent: 4857161 (1989-08-01), Borel et al.
patent: 4857799 (1989-08-01), Spindt et al.
patent: 4923421 (1990-05-01), Brodie et al.
patent: 5010038 (1991-04-01), Fox et al.
patent: 5015912 (1991-05-01), Spindt et al.
patent: 5056702 (1991-10-01), Nakahashi et al.
patent: 5063327 (1991-11-01), Brodie et al.
patent: 5075591 (1991-12-01), Holmberg
patent: 5081067 (1992-01-01), Shimizu et al.
patent: 5140219 (1992-08-01), Kane
patent: 5151061 (1992-09-01), Sandhu
patent: 5157304 (1992-10-01), Kane et al.
patent: 5217922 (1993-06-01), Akasaki et al.
patent: 5249732 (1993-10-01), Thomas
patent: 5250847 (1993-10-01), Baskett
patent: 5258330 (1993-11-01), Khandros et al.
patent: 5347428 (1994-09-01), Carson et al.
patent: 5381039 (1995-01-01), Morrison
"Liquid Crystal Display Products", Product Brochure, Standish LCD, Division of Standish Industries, Inc., pp. 5-6. Date Unknown.
"Process-Stabilized Extrude Bonding Wire and Ribbon", Product Brochure, Hydrostatics Inc., Bethlehem PA, (Jun. 1991).
Kondoh, You et al. "A Subminiature CCD Module Using a New Assembly Technique", IEICE Transactions, vol.E 74, No. 8 Aug. 1991.
Cohen, I.M. et al. "Ball Formation Processes in Aluminum Bonding Wire", Solid State Technology, pp. 89-92, Dec. 1985.
Levy, F. et al. "Phosphors for Full Color Microtips Fluorescent Displays", pp. 20-23, IEEE, 1991.
Kang, Sa-Yoon et al. "Physical and Fuzzy Logic Modeling of a Flip-Chip Thermocompression Bonding Process", Journal of Electronic Packaging, pp. 63-70, Mar. 1993.
Charles, Jr., H.K. "Electronic Materials Handbook--vol. 1 Packaging", Product Brochure, ASM International Date Unknown.
Montgomery, Clive Richard, "Flip Chip Assemblies Using Conventional Wire Bonding Apparatus and Commercially available Dies," ISHM '93 Proceedings, pp. 451-456.
IBM Technical Disclosure, "Direct Chip Bonding For Liquid Crystal Display", vol. 34, No. 5, Oct. 1991 pp. 183-184.

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