Multi-layer dielectric structure

Details Multi-layer dielectric structure Multi-layer dielectric structure

1978-06-23

1980-03-11

Wojciechowicz, Edward J.

357 68, H01L 3902

Patent

active

041930827

ABSTRACT:
The coating of a conductor pattern on dielectric green sheets to a common edge thereof with stacking or superimpositioning together of a plurality of sheets to enclose the conductor pattern followed by sintering, with the edge side of the fired body having the exposed end terminations becoming the actual face of the body on which a semiconductor device is mounted in electrical circuit connection to respective ones of the common end terminations of the conductor runs. The opposite or distal ends of the conductor runs may be fanned out to the opposite edge of side of the fired body in increased spaced relationship to each other.

REFERENCES:
patent: 3959579 (1976-05-01), Johnson
patent: 3968193 (1976-07-01), Langston et al.

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