Multi-layer dielectric planar structure having an internal condu

Details Multi-layer dielectric planar structure having an internal condu Multi-layer dielectric planar structure having an internal condu

1978-06-23

1980-05-06

James, Andrew J.

Electricity: electrical systems and devices

Safety and protection of systems and devices

With specific current responsive fault sensor

357 68, 357 65, 357 70, 361414, 361415, 174 685, H01L 3902, H01L 2348, H01L 2944

Patent

active

042020077

ABSTRACT:
The coating of a conductor pattern on dielectric green sheets to a common edge thereof with stacking or superimpositioning together of a plurality of sheets to enclose the conductor pattern followed by sintering, with the edge side of the fired body having the exposed end terminations becoming the actual face of the body on which a semiconductor device is mounted in electrical circuit connection to respective ones of the common end terminations of the conductor runs. The conductor runs are returned through the body to the active face of the body to position the opposite or distal ends of the conductors thereat, in an increased spaced relationship of the distal conductor terminations. For external connection, terminal pins may be embedded in the fired body for connection at adjacent and to the distal conductor termination, with the pins projecting therefrom.

REFERENCES:
patent: 3323198 (1967-06-01), Shortes
patent: 3436604 (1969-04-01), Hyltin et al.
patent: 3555364 (1971-01-01), Matcovich
patent: 3605063 (1971-09-01), Stewart
patent: 3746932 (1973-07-01), Hogan et al.
patent: 3746934 (1973-07-01), Stein
patent: 3746973 (1973-07-01), McMahon
patent: 3795845 (1974-03-01), Cass et al.
patent: 3876822 (1975-04-01), Davy et al.
RCA Technical Notes; by L. Balents; Hermetically Sealed Semiconductor Flip-Chip Assembly, No. 857, pp. 1 & 2, Feb. 11, 1970.
IBM Technical Disclosure Bulletin, vol. 15, No. 8, Jan. 1973, Replaceable Engineering Change Pad; by Simek, pp. 2575 and 2576.

Affiliated with

Also associated with

Rating

Multi-layer dielectric planar structure having an internal condu does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multi-layer dielectric planar structure having an internal condu, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multi-layer dielectric planar structure having an internal condu will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1007926