Multi-layer conductor plate and a method of making

Details Multi-layer conductor plate and a method of making Multi-layer conductor plate and a method of making

1982-08-24

1985-05-28

Kucia, R. R.

Electricity: conductors and insulators

Conduits, cables or conductors

Single duct conduits

361414, H05K 109

Patent

active

045202281

ABSTRACT:
A multi-layer conductor plate consists of a copper-clad base plate (1) on which a first layer of conductor paths (2,3,4; 5,6,7) is formed by applying an etch-resistant, electrically conductive varnish at the respective locations. The copper layers not covered by the etch-resistant varnish are removed by etching in etching bath. Subsequently an insulating varnish layer (16) is applied at least in the area of intersections of conductor paths of the first layer and a second layer. A varnish adapted to be galvanized and preferably being carbonaceous is applied at predetermined locations and subsequently coated with a metal layer applied galvanically.

REFERENCES:
patent: 3167490 (1965-01-01), Friedman
patent: 3560256 (1971-02-01), Abrams
patent: 3798762 (1974-03-01), Harris et al.
patent: 3998677 (1976-12-01), Anderson et al.
patent: 4402135 (1983-09-01), Schweingrubner et al.
patent: 4440823 (1984-04-01), Hoffmann
"Method for Producing Three Dimensional Printed Circuits", by Klippel, IBM, Tech. Dis. Bulletin, vol. 2, No. 4, Dec. 1959, pp. 7 and 8.

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