Multi-layer circuitry

Details Multi-layer circuitry Multi-layer circuitry

1982-08-30

1989-05-02

Kucia, R. R.

Electricity: electrical systems and devices

Miscellaneous

361388, 361402, 361412, H05K 118

Patent

active

048273775

ABSTRACT:
Multi-layer circuitry incorporating electronic elements is disclosed. The circuitry comprises a plurality of layers including a metal or alloy substrate formed with a recess on one surface. An electronic element is positioned within the recess and a second electronic element is positioned on the surface. Also, a first dielectric material layer is disposed on the surface. Further, a first layered conductive circuit pattern overlies the first dielectric material layer so as to provide circuitry over a substantial portion of the substrate. The first circuit pattern is electrically connected to the first electronic element. The first circuit pattern also has a cavity therein for receiving the second electronic element. A second layered conductive pattern overlies at least a portion of the first layered conductive circuit pattern and the second electronic element and is electrically connected to the second electronic element. A second dielectric material layer is disposed between the first and second layered conductive circuit patterns so that these circuit patterns are bonded to and isolated from each other.

REFERENCES:
patent: 3296099 (1967-01-01), Dinella
patent: 3875478 (1975-04-01), Capstick
patent: 4109054 (1978-08-01), Burgyan
patent: 4385202 (1983-05-01), Spinelli et al.
patent: 4491622 (1985-01-01), Butt
"Ceramic Glossary, 1984" by Walter W. Perkins, published by The American Ceramic Society, Inc.

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