Multi-layer circuit structures, methods of making same and compo

Details Multi-layer circuit structures, methods of making same and compo Multi-layer circuit structures, methods of making same and compo

1994-07-21

1996-09-24

Ryan, Patrick

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428 76, 428246, 174258, 174261, 174262, 361779, 361795, 29830, 29852, 29847, 257675, B32B 900

Patent

active

055589286

ABSTRACT:
A multi-layer circuit panel assembly is formed by laminating circuit panels with interposers incorporating flowable conductive material at interconnect locations and a flowable dielectric materials at locations other than the interconnect locations. Excess materials are captured in reservoirs such as within vias in the circuit panels and apertures in interior elements within the interposers. The flowable materials of the interposers, together with the reservoirs, allow the interposers to compress and take up tolerances in the components. The flowable dielectric material encapsulates conductors on the surfaces of the circuit panels.

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