Multi-layer circuit board, method of manufacturing the same and

Details Multi-layer circuit board, method of manufacturing the same and Multi-layer circuit board, method of manufacturing the same and

1990-03-07

1991-11-12

Picard, Leo P.

Electricity: electrical systems and devices

Miscellaneous

H05K 111

Patent

active

050652850

ABSTRACT:
The dislocation between each layer in a multi-layer circuit board and a process for producing the same and an application of the same is minimized by employing a specific adhesive layer between layers of the circuit board. The adhesive layer is composed of a film of a resin having a melting point higher than a temperature for forming the multi-layer (or laminated layer) circuit board and adhesive having a melting point lower than the temperature for forming the multi-layer circuit board.

REFERENCES:
patent: 3952231 (1976-04-01), Davidson et al.
patent: 4626961 (1986-12-01), Ono et al.
patent: 4774632 (1988-09-01), Neugebauer

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