Multi-layer circuit board having a large heat dissipation

Details Multi-layer circuit board having a large heat dissipation Multi-layer circuit board having a large heat dissipation

1986-09-29

1988-02-09

Nimmo, Morris H.

Electricity: conductors and insulators

Conduits, cables or conductors

Single duct conduits

361411, 361414, H05K 100

Patent

active

047242833

ABSTRACT:
A multi-layer circuit board is disclosed which includes a plurality of AlN ceramic layers stocked and combined as an integrated form and wiring layers interposed at different levels between the AlN ceramic layers. The wiring layers are made of a mixture of tungsten and AlN ceramic particles, the content of the AlN ceramic particles being 0.5 to 2.0 wt. %. A plurality of through-holes are formed in the AlN ceramic layers to interconnect the wiring layers formed at different levels.

REFERENCES:
patent: 3770529 (1973-11-01), Anderson
patent: 4328531 (1982-05-01), Nagashima et al.
patent: 4336088 (1982-06-01), Hetherington et al.
patent: 4465727 (1984-08-01), Fujita et al.
patent: 4578365 (1986-03-01), Huseby et al.
patent: 4598167 (1986-07-01), Ushifusa et al.

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