Multi-layer circuit board and semiconductor flip chip connection

Details Multi-layer circuit board and semiconductor flip chip connection Multi-layer circuit board and semiconductor flip chip connection

1996-07-22

1998-06-16

Sparks, Donald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174255, 174260, 174261, 257728, 333247, 361772, 361774, 361783, 361780, H05K 111, H05K 702, H01L 2334, H01P 100

Patent

active

057681090

ABSTRACT:
A multi-layer circuit board (11) has a cofired ceramic with a configuration of circuit traces (27) extending though differing layers of the multi-layer circuit board (11) to facilitate mountable conductive contact with semiconductor flip chips (13). Via holes (23) are precisely formed in the multi-layer circuit board (11) and are filled with solder or conductive epoxy. Semiconductor chips (13) have an array of metallic posts (19) alignable with the holes (23) and are mounted upon the upper surface of the multi-layer circuit board (11) in plug fashion. An aperture (25) may be formed in multi-layer circuit board (11) directly below each semiconductor chip (13) for protection of the circuitry on semiconductor chip (13) from contact with multi-layer circuit board (11). The via holes (23) and transmission line structure of the circuit board (11) are precisely formed to achieve a desired characteristic impedance.

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